| AMA Conferences 2013 |
B1.1 - Advanced Finite Element Schemes for Multiphysics |
M. Kaltenbacher, S. Triebenbacher - Vienna University of Technology (Austria) |
| AMA Conferences 2013 |
B1.2 - Problem-adapted Modeling of RF MEMS Switches |
G. Schrag, T. Künzig, M. Nießner - Munich University of Technology (Germany) |
| AMA Conferences 2013 |
B1.3 - Design Study of a Wireless Pressure Sensor for Medical Application |
G. Bruckner, J. Schicker, N. Schobernig - CTR AG Carinthian Tech Research, Villach (Austria), V. Stojanov, P. Schlumpf - Unisensor AG, Attikon (Switzerland) |
| AMA Conferences 2013 |
B1.4 - Simulation of Electromagnetic Flow Meters Using the Boundary Element Method |
R. Friedrichs, E. Weiß - SIKA Dr. Siebert & Kühn GmbH & Co. KG, Kaufungen (Germany) |
| AMA Conferences 2013 |
B2.1 - Efficient Design of Dynamic Systems by Combining Network Methods with Finite-Element Methods |
U. Marschner, G. Pfeifer - Technische Universität Dresden (Germany), E. Starke - Institute of Lightweight Engineering and Polymer Technology, Dresden (Germany) |
| AMA Conferences 2013 |
B2.2 - Network Representation of User’s Mechanical Impedance as Design and Evaluation Basis for Task-Specific Haptic Systems |
C. Hatzfeld, C. Neupert, J. Lotichius, R. Werthschützky - Technische Universität Darmstadt (Germany), T. Kern - Continental Corporation, Babenhausen (Germany) |
| AMA Conferences 2013 |
B2.3 - Combined Simulation of a Modified Piezoelectric Plate Transducer |
M. Krause, E. Starke, G. Pfeifer, T. Zahnert, W. Fischer - Technische Universität Dresden (Germany) |
| AMA Conferences 2013 |
B2.4 - Numerical simulation of a MEMS Pirani vacuum sensor |
S. Quednau, H. Schlaak - Technische Universität Darmstadt (Germany), F. Völklein - RheinMain University of Applied Sciences (Germany) |
| AMA Conferences 2013 |
B3.1 - Assembly and Interconnection Technologies for Sensors for Very High Temperature Applications |
J. Wilde, P. Wagner, R. Zeiser - University of Freiburg (Germany) |
| AMA Conferences 2013 |
B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers |
F. Roscher, A. Otto, R. Döring, S. Rzepka, M. Wiemer - Fraunhofer Institute for Electronic Nano Systems, Chemnitz (Germany), M. Ihle, S. Ziesche - Fraunhofer Institute for Ceramic Technologies and Systems, Dresden (Germany) |