5.3.4 - A Two-Stage Encapsulation Procedure for Sterilization-Resistant MEMS Devices With Integrated SMA Actuator
- Event
- EUROSENSORS 2026
2026-09-06 - 2026-09-09
Zurich - Band
- Lectures
- Chapter
- Sensor Arrays and Networks, Integrated Systems
- Author(s)
- D. Hoffmann, D. Schuhmacher, N. Burghardt, A. Dehé - Hahn-Schickard,Villingen-Schwenningen (Germany), A. Erben - Fraunhofer IWU,Dresden (Germany)
- Pages
- 182 - 183
- DOI
- 10.5162/eurosensors2026/5.3.4
- ISBN
- 978-3-910600-12-6
- Price
- free
Abstract
In this paper we propose a wafer level encapsulation approach for heterogenous integration of SMA wire actuators at low temperatures. The approach is based on the combination of anodic pre-bonding and laser bonding. For the first time, a MEMS-based sterilization counter device was realized withstanding the harsh conditions associated with cleaning and sterilization procedures applied for medical instruments. A reliability of up to 93% was achieved for recording of 125 performed reprocessing cycles.