2.1 - Low power consumption infrared thermal sensor array for smart detection and thermal imaging applications
- AMA Conferences 2013
2013-05-14 - 2013-05-16
- Proceedings IRS² 2013
- I2 - Recent Developments in IR Industry
- P. Robert, F. Trolez, E. Bercier, H. Clerambault, A. Touvignon, J. Tissot - ULIS, Veurey-Voroize (France)
- 24 - 27
The high level of accumulated expertise by ULIS and CEA/LETI on the development and the manufacturing of InfRared (IR) thermal sensors arrays based on amorphous silicon microbolometer technology enables ULIS to develop a new generation of IR sensor thermal array, Micro80P™, with optimized power consumption that meets the needs of smart detection and low resolution thermal imaging applications. The ReadOut Integrated Circuit (ROIC) architecture of an 80x80 format sensor will be described where innovations are widely on-chip implemented allowing an easier operation by the user, in particular with the standardization of the sensor interfaces. Then, the paper will focus on the low power consumption management system embedded in the ROIC. Finally, packaging technology improvements will be disclosed, such as Pixel Level Packaging (PLP), offering highly costeffective solutions.