2.3 - Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process
- Event
- AMA Conferences 2013
2013-05-14 - 2013-05-16
Nürnberg - Band
- Proceedings IRS² 2013
- Chapter
- I2 - Recent Developments in IR Industry
- Author(s)
- M. Krueger - Robert Bosch GmbH, Reutlingen (Germany), I. Herrmann - Robert Bosch GmbH, Gerlingen (Germany)
- Pages
- 32 - 36
- DOI
- 10.5162/irs2013/i2.3
- ISBN
- 978-3-9813484-3-9
- Price
- free
Abstract
In order to achieve substantial cost reduction for far-infrared focal plane arrays (FPA), consequent adoption of existing high-volume MEMS processes is required. For that reason we used a high-volume pressure sensor process for fabrication of thermodiode FPA. While 1st Gen FPA successfully proved the suitability of the fabrication process, performance was strongly improved for the 2nd Gen FPA to meet customer demands for low-cost thermal imaging and thermal sensitivity of 270 mK @ f/1.0 and 9 Hz frame rate was achieved. In addition development of the 3rd Gen FPA with QVGA format, 28 μm pixel pitch and 100 mK thermal sensitivity is ongoing.