P1.6 - New Materials, Processes and design Methods for the Chip Mounting of High-Temperature Sensors
- Event
- AMA Conferences 2017
2017-05-30 - 2017-06-01
Nürnberg, Germany - Band
- Proceedings Sensor 2017
- Chapter
- P1 - Materials and Technology
- Author(s)
- M. Feißt, N. Subbiah, R. Zeiser, E. Möller, J. Wilde - University of Freiburg (Germany)
- Pages
- 574 - 577
- DOI
- 10.5162/sensor2017/P1.6
- ISBN
- 978-3-9816876-4-4
- Price
- free
Abstract
In this research work, a comparison of different die attachment approaches is established. The approaches involve electrically conductive adhesive, transient liquid phase bonding, silver sintering and glass bonding. The main target is to minimize mechanical stresses due to die attachment process temperatures and differences in the coefficients of thermal expansion (CTE). Therefore test chips and sensors are mounted onto various ceramic substrates as AIN, Alumina, AIN DCB using area contact geometries for die attachment.
In our work, different sensors and power devices especially designed for working up to 500°C are used as the die element. A comparative study is performed with variations of materials, assembly and die attachment techniques. Experimental results and process parameters are presented for individual approaches. Also a method to stress modeling of the assembly using optical digital image correlation is given.