2.3 A new Modular Electronics Approach applied to Instrumentation Units
- Event
- ettc2020 - European Test and Telemetry Conference
2020-06-23 - 2020-06-25
Virtual Conference - Chapter
- 2. Data Acquisition
- Author(s)
- G. Guerrero, O. Pinto, V. Chomel - Safran Data Systems, Courtaboeuf Cedex (France), F. Monteil - Safran Data Systems GmbH, Bergisch-Gladbach (Germany)
- Pages
- 65 - 73
- DOI
- 10.5162/ettc2020/2.3
- ISBN
- 978-3-9819376-3-3
- Price
- free
Abstract
One of the main challenges of an instrumentation engineer is to provide accurately the required information while preserving the test vehicle inherent behavior - which, somewhere, breaches the universal Heisenberg uncertainty principle. This article presents the results of a technology investigation based on an original modular 3D electronic design. This technology aims at minimizing the intrusiveness of an instrumentation system while offering flexibility, scalability, reliability and performances. Based on a return of experience from the legacy and current instrumentation systems, the study also addresses the daily operational constraints faced by an instrumentation engineer: auto-configuration, plug and play, fast reconfiguration, harsh environmental conditions,…