W8.3.1 - Strain Sensors Based on Hybrid Electronics with Flexible Packaging
- Event
- EUROSENSORS XXXVII
2025-09-07 - 2025-09-10
Wroclaw - Band
- Lectures
- Chapter
- W8.3 - Biochemical and Phyxical Sensors
- Author(s)
- D. Zymelka, Y. Takei - National Institute of Advanced Industrial Science and Technology, Tsukuba (Japan)
- Pages
- 198 - 199
- DOI
- 10.5162/EUROSENSORS2025/W8.3.1
- ISBN
- 978-3-910600-07-2
- Price
- free
Abstract
Flexible printed strain sensors have a broad range of applications, primarily in wearable technologies,but they are also being explored in less conventional areas, such as strain measurement on engineering structures- the main target application of the sensors investigated in this work. In response to the global challenge posedby the rapidly aging road and bridge infrastructure, this study focuses on the development of large-area, flexiblestrain sensors intended for civil infrastructure monitoring. The fabrication process and sensor design are basedon a multilayered construction and hybrid electronics, combining printed electronics with conventional components.Sensor evaluation demonstrates good strain sensitivity and a linear output signal, indicating potential for practicalapplications in local strain distribution analysis.