Available documents

Event Title Author(s)
SMSI 2023 E6.3 - Integrated Signal Amplification and Conditioning of Pyroelectric Sensor Elements R. Lehmkau - InfraTec GmbH, Dresden (Germany)
SMSI 2023 E6.4 - Biological Neural Coding for Adaptive Spiking Analog to Digital Conversion H. Abd, A. König - Technical University of Kaiserslautern, Kaiserslautern (Germany)
SMSI 2023 E7.1 - Miniaturized SMD-Reflow-Capable Photoacoustic CO2-Sensor Using a Dual-Chamber Approach S. Gaßner, K. Schmitt, J. Wöllenstein - University of Freiburg, Freiburg (Germany), D. Tumpold - Infineon Technologies AG, Neubiberg (Germany), S. Essing - Technical University of Munich, München (Germany)
SMSI 2023 E7.2 - Cutout as Augmentation in Constrative Learning for Detecting Burn Marks in Plastic Granules M. Jin, M. Heizmann - Karlsruher Institut für Technologie, Karlsruhe (Germany)
SMSI 2023 E7.3 - Development of a Chromatic Confocal Sensor Model Dedicated to Investigating Object-Dependent Effects D. Linnert, U. Neuschaefer-Rube - Physikalisch-Technische Bundesanstalt, Braunschweig (Germany), M. Stavridis - Physikalisch-Technische Bundesanstalt, Berlin (Germany)
SMSI 2023 E7.4 - Magnetic Field Measurement as an Essential Part of Quality Control S. Rivera, A. Mohanr - ITK Dr. Kassen GmbH, Lahnau (Germany), B. Wenzel - Matesy GmbH, Jena (Germany)
SMSI 2023 P01 - Non-Overlap Image Registration S. Siemens, M. Kästner, E. Reithmeier - Leibniz Universität Hannover, Garbsen (Germany)
SMSI 2023 P02 - Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes S. Kamrani, F. Dencker, R. Ottermann, M. Wurz - Leibniz University Hannover, Garbsen (Germany)
SMSI 2023 P03 - Unveiling charge carrier dynamics of GaN-based materials through a combined Cathodoluminescence and Kelvin Probe Force Microscopy under variable illumination protocol P. González-Izquierdo, L. Borowik, M. Charles, P. Le Maitre, N. Rochat, J. Simon, M. Volpert, D. Zoccarato - Grenoble Alpes University, Grenoble (France)
SMSI 2023 P04 - Stress Analysis in Drivers Using Wavelet Analysis M. Bussas, C. Heidemann - Trout GmbH, Kassel (Germany)