A4.3 - The Infineon Silicon MEMS Microphone

Event
AMA Conferences 2013
2013-05-14 - 2013-05-16
Nürnberg
Band
Proceedings SENSOR 2013
Chapter
A4 - Audio Transducers
Author(s)
A. Dehé, M. Wurzer, M. Füldner, U. Krumbein - Infineon Technologies AG, Munich (Germany)
Pages
95 - 99
DOI
10.5162/sensor2013/A4.3
ISBN
978-3-9813484-3-9
Price
free

Abstract

This paper reports on the state of the art silicon micromachined microphone utilizing a dual poly silicon membrane system. MEMS chips from 1.4mm down to 1.0mm side length are applied for mobile communication. Design aspects related with key performance parameters such as sensitivity, signal to noise ration and distortion are discussed. Sensitivity of -38BV/Pa is achieved for different microphone membrane diameters. A maximum signal to noise ration of 66dB(A) for the largest system could be achieved. The perfect fit of simulation versus measurements enables deeper analysis and balancing of noise contributors. Environmental noise suppression of 5dB by acoustical high pass design is demonstrated.

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