B3.4 - Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants

Event
AMA Conferences 2013
2013-05-14 - 2013-05-16
Nürnberg
Band
Proceedings SENSOR 2013
Chapter
B3 - Packaging
Author(s)
T. Rossner, R. Sarwar, A. Lyashenko, E. Dörsam, R. Werthschützky - Technische Universität Darmstadt (Germany)
Pages
248 - 251
DOI
10.5162/sensor2013/B3.4
ISBN
978-3-9813484-3-9
Price
free

Abstract

This paper presents a novel concept of hot stamped conductors on wires in a nano- or microscale. The process of producing arrays of wires selectively on the desired contact pad by electroplating of a template foil is described. The new concept provides electrical conductivity by penetration of wire arrays through the conductive layer of a hot stamping foil. Because of the small cross section of the wires, a large surface provides a low resistance between the contact pad and the conductor. With this process the non-conductive layer of the hot stamping foil does not have to be removed. The wires are flexible and provide a good alternative for electrical connection of flexible electronics. Also the process temperature is low, which makes it possible to use materials which are sensitive to high temperatures. When renouncing the use of temperature sensitive materials, this method can be applicable for high temperature operation due to the lack of adhesive or solder.

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