B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
- AMA Conferences 2013
2013-05-14 - 2013-05-16
- Proceedings SENSOR 2013
- B3 - Packaging
- F. Roscher, A. Otto, R. Döring, S. Rzepka, M. Wiemer - Fraunhofer Institute for Electronic Nano Systems, Chemnitz (Germany), M. Ihle, S. Ziesche - Fraunhofer Institute for Ceramic Technologies and Systems, Dresden (Germany)
- 236 - 241
In this work, we will describe a promising procedure for the development of a silicon based micro electro mechanical system (MEMS) suitable for 300°C operation temperature. Design aspects as well as a suitable packaging concept and technology will be highlighted. The value of accompanying FEM simulations together with the usage of novel reliability tools will be demonstrated as a design and construction accelerator that can help to avoid typical mistakes within the material selection and concept phase of a MEMS fabrication process. We will give an introduction for suitable wafer-levelbonding methods for multilayer stacking of functional substrates especially for the heterogeneous integration of silicon and low temperature co-fired ceramic LTCC. The fabrication process for LTCC with electrical feed troughs and for Silicon substrates with through silicon vias TSVs and a subsequent electrical interconnection between both will also be topics of this work.