M3.3.2 - Lock and Key Interconnects for Modular Flexible and Printed Electronics
- Event
- EUROSENSORS XXXVII
2025-09-07 - 2025-09-10
Wroclaw - Band
- Lectures
- Chapter
- M3.3 - Novel Technologies and Applications of Sensors 1
- Author(s)
- P. G. Perez, E. B. Alexandre, M. Bleidy, S. Lengger, J. Kosel, M. T. Vijjapu - Silicon Austria Labs GmbH, Villach (Austria)
- Pages
- 98 - 99
- DOI
- 10.5162/EUROSENSORS2025/M3.3.2
- ISBN
- 978-3-910600-07-2
- Price
- free
Abstract
In rigid electronic systems, various methods such as USB connectors and pin headers enable temporary electrical and mechanical connections between components. Conversely, such solutions are still lacking in the flexible electronics landscape. This work introduces a novel interconnection method for flexible and printed electronics, using mechanically defined grooves in the encapsulation layer to align with contact pads on detachable modules, enabling robust and reliable connections between flexible elec-tronic segments. Inspired by a lock-and-key mechanism, it enhances modularity without requiring addi-tional materials or components, preserving system design while supporting reconfigurable integration, mechanical flexibility, and reduced material usage—a scalable and sustainable solution for next-gener-ation electronics.