C6-a3 - Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves
- Event
- 2025 ICU PADERBORN - 9th International Congress on Ultrasonics
2025-09-21 - 2025-09-25
Paderborn - Band
- Lectures
- Chapter
- C6-a - Guided Waves and Their Applications in NDT and SHM
- Author(s)
- H. Zeipert, T. Nellius, N. Schönlau, M. Wippermann, L. Claes, B. Henning - Paderborn Universtity, Paderborn (Germany), M. Nicolai, J. Prager - Federal Institute for Material Research and Testing, Berlin (Germany)
- Pages
- 207 - 210
- DOI
- 10.5162/Ultrasonic2025/C6-a3
- ISBN
- 978-3-910600-08-9
- Price
- free
Abstract
A measurement setup for the selective excitation of guided ultrasonic waves in adhesively bonded plates is introduced. Changes of the dispersive behaviour of the guided waves during the curing process is known to be accompanied by a change in the propagating waves group velocities. The proposed measurement setup is used to monitor that change during the curing process of an aluminium-epoxy-polycarbonate bond.