Mo-ESM-06 - Direct Sputter Deposition of Gold Thin-Film Sensors on Wood Substrates toward Chip-on-Wood Integration

Event

EUROSENSORS 2026
2026-09-06 - 2026-09-09
Zurich

Band

Poster

Chapter

Emerging Sensor Materials

Author(s)

P. Reber, N. Daupayev, M. Lang, S. Hirsch - Brandenburg University of Applied Science,Brandenburg/Havel (Germany)

Pages

455 - 456

DOI

10.5162/eurosensors2026/Mo-ESM-06

ISBN

978-3-910600-12-6

Price

free

Abstract

This work presents a first step toward realizing Chip-on-Wood systems, a novel integration concept in which microelectronic chips are directly mounted on wood substrates equipped with sputtered thin-film sensors. Gold thin-film structures were deposited on prepared beech wood surfaces via shadow mask sputtering, demonstrating good adhesion and continuous electrical conductivity. The approach eliminates conventional electrode insertion, reduces signal losses, and is fully compatible with future microelectronic integration, offering potential for miniaturized, energy-efficient sensing systems for structural health monitoring in timber construction.