B4.1 - Trends in Assembly and Packaging of Sensors
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume I
- Chapter
- B4 - Sensor Packaging
- Author(s)
- J. Wilde - Universität Freiburg, Freiburg, Germany
- Pages
- 205 - 210
- DOI
- 10.5162/sensor09/v1/b4.1
- ISBN
- 978-3-9810993-4-8
- Price
- free
Abstract
In this paper, some trends in the industrial assembly and packaging of sensors are described. We confine the analysis mainly to multifunctional housing technologies. In detail transfer moulded and pre-moulded packages, moulded interconnect devices and LTCC housing are compared. In the case of moulded packaging, multi-chip solutions for SiP as well as chip-scale packages are noteworthy. For pre-moulded housings of single components packages with standard outlines are used, while for sensor systems in mechatronics application-specific multi-functional packages will dominate. A further development is the injection moulded interconnect device MID which serves as a mechanical precision carrier, wiring substrate and package body altogether. In the field of hermetic packaging co-fired ceramics can be used as substrates and housings which are well suited for extremely harsh environments. The use of hermetic wafer-level packaging is an alternative which protects free-standing sensing structures effectively while at the same time the economic advantages of plastic packages can be maintained. All theses technologies are evaluated comparatively.