| SENSOR+TEST Conferences 2009 |
B4.1 - Trends in Assembly and Packaging of Sensors |
J. Wilde - Universität Freiburg, Freiburg, Germany |
| SENSOR+TEST Conferences 2009 |
B4.2 - Analyzing Amplitude and Phase Response of a Differential Pressure Sensor Using a Dynamic Pressure Source |
T. Kober, I. Stoehr, S. Sindlinger, R. Werthschuetzky - Technische Universität Darmstadt, Darmstadt, Germany |
| SENSOR+TEST Conferences 2009 |
B4.3 - INKtelligent Printing® of Scale Comprehensive Electrical Connections for Thermal Flow Sensors |
C. Sosna, H. Sturm, R. Buchner, W. Lang - University of Bremen, Bremen, Germany, C. Werner, D. Godlinski, V. Zoellmer, M. Busse - Fraunhofer Institut für Fertigungstechnik und Angewandte Materialforschung, Bremen, Germany |
| SENSOR+TEST Conferences 2009 |
B4.4 - New Packaging of Flow Sensors with Monolithic Integration of Micro-Channel on Chip |
S. Billat, K. Kliche, R. Gronmaier, J. Auber, F. Hedirch, M. Ashauer, R. Zengerle - HSG-IMIT Hahn-Schickard Gesellschaft, Villingen-Schwenningen, Germany |