P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume II
- Chapter
- P1 - Mechanical Sensors
- Author(s)
- E. Deier, J. Wilde - University of Freiburg, Freiburg, Germany
- Pages
- 283 - 287
- DOI
- 10.5162/sensor09/v2/p1.12
- ISBN
- 978-3-9810993-5-5
- Price
- free
Abstract
In order to predict the performance of micro-systems in the development process, simulation has become an indispensable tool. Thermo-mechanical effects are among the strongest ones affecting the accuracy of micro-mechanical sensors. In this work, the procedures to predict the functional behaviour of microdevices correctly are demonstrated, taking into account packaging and assembly effects. The necessary models and data for a prediction of the thermo-mechanical behaviour are presented. The simulation accuracy depends substantially on the quality of the used materials data. Realistic results can only be achieved when time-temperature dependencies and non-linearity of the materials as well as correct process modelling are taken into account altogether. It will be demonstrated on the example of a pressure sensor how a new quality of prognosis will be possible when assembly and packaging are also regarded in the device design.