P1.14 - Miniaturised Ceramic Packages for Piezoresistive Pressure Sensors
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume II
- Chapter
- P1 - Mechanical Sensors
- Author(s)
- C. Wohlgemuth, A. Leidl, G. Feiertag, W. Pahl - EPCOS AG, München, Germany
- Pages
- 295 - 300
- DOI
- 10.5162/sensor09/v2/p1.14
- ISBN
- 978-3-9810993-5-5
- Price
- free
Abstract
The precision of piezoresistive pressure transmitters is often limited by packaging effects. Especially the mounting of the sensor die plays a decisive role. While non-linearity and temperature dependence of the MEMS sensor itself can be compensated by signal conditioners, this is not possible for hysteresis and drift effects caused by inadequate die mounting. Coatings on the sensor die also emerge measurement errors.
In this paper the effects of mounting on the sensor die are described and two different of pressure sensors in ceramic packages are presented. One small sized differential pressure sensor with high accuracy and one extremely miniaturized barometric absolute pressure sensor especially designed for high volume processability.