TP30 - Sputter deposited aluminum nitride for an efficient manufacturing of piezoelectric folded MEMS membranes
- Event
- EUROSENSORS XXXVII
2025-09-07 - 2025-09-10
Wroclaw - Band
- Poster II
- Chapter
- MEMS and MOEMS
- Author(s)
- M. T. Becker, D. Becker, A. Bittner, A. Dehé - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V., Villingen-Schwenningen (Germany), A. Dehé - Albert-Ludwigs-Universität, Freiburg (Germany)
- Pages
- 409 - 410
- DOI
- 10.5162/EUROSENSORS2025/TP30
- ISBN
- 978-3-910600-07-2
- Price
- free
Abstract
Folded membranes with high aspect ratio features and vertical sidewalls utilize conformal aluminum nitride (AlN) layers to maximize the active area of MEMS transducer chips [1,2]. This work studies the possibilities and limitations of efficient sputtering to replace the currently used atomic layer deposition (ALD) by a denser, crystalline and faster deposited thin film. Scanning electron microscopy (SEM)analysis of test structures show the successful coverage of features with aspect ratios of up to 12:1 byvariation of process parameters such as the working distance and the nitrogen to argon gas flow ratio.