TP41 - Flip Chip bonding of bare die on a flexible PET substrate with ablated copper.
- Event
- EUROSENSORS XXXVII
2025-09-07 - 2025-09-10
Wroclaw - Band
- Poster II
- Chapter
- Physical Sensors
- Author(s)
- M. H. Malik, M. T. Vijjapu, E. Bezerra, S. L. Thomas - Silicon Austria Labs, Villach (Austria), E. Bezerra - École Polytechnique Fédérale de Lausanne (EPFL) (Switzerland), C. Kollegger, T. Herndl - Infineon Technologies Austria AG, Graz (Austria), A. Levy, E. Dvash - KLA Corporation, Yavna (Israel)
- Pages
- 438 - 439
- DOI
- 10.5162/EUROSENSORS2025/TP41
- ISBN
- 978-3-910600-07-2
- Price
- free
Abstract
The use of low-cost materials such as PET, paper, and unpackaged bare dies has become critical for cost-effective mass production, as demand for flexible hybrid electronics has skyrocketed, particularly for internet of things (IoT), electronic skin, and wearable applications. The advantages of this design include the sustainable use of resources, such as low-cost, readily accessible, and biologically degrada-ble raw materials, and their suitability for printed electronics applications has been well researched. Mostly printed silver and sputtered silver has covered this market but has its own shortcomings. Com-bining this with techniques such as flip chip bonding and subtractive laser ablation provides us with the opportunity of fast fabrication and smaller size which can cater for new applications. In this study, we look at the flip chip bonding bare die to ablated copper on a PET substrate aided with anisotropic con-ductive paste. Furthermore, we investigate its reliability by performing bending tests.