P6.6 - Integrated Package Modules for Power and Sensor Applications
- Event
- SENSOR+TEST Conferences 2011
2011-06-07 - 2011-06-09
Nürnberg - Band
- Proceedings SENSOR 2011
- Chapter
- P6 - Technology, Materials
- Author(s)
- A. Longford, D. Federici - Interplex Engineered Products, East Providence (USA), J. Lynch - Interplex Industries Inc, New York (USA)
- Pages
- 815 - 820
- DOI
- 10.5162/sensor11/sp6.6
- ISBN
- 978-3-9810993-9-3
- Price
- free
Abstract
Developing technologies continue to demand performance extremes from electronic module designs. Applications for multiple chip packages, power conversion and generation, MEMs devices, Solar, LED and Automotive Interfaces are seeing needs for improved thermal dissipation, resistance to shock and extended environment protection. As requirements become more demanding and raw material costs are increasing the needs to enhance device performance continue to challenge packaging designers and manufacturers.
Both power and sensor modules are now taking advantage of the up and coming Press-Fit interconnection technology that has been widely used in the telecom and industrial markets for over 50 years. Press-Fit allows electronic modules to operate under aggressive environmental conditions, designed to withstand the added rigors of vibration, thermal shock and much higher ampacity requirements.
A range of modules have been developed that incorporate, device interconnections, test capability and direct chip mount for sensor units along with fixed type connector designs. Additionally the need for more power has seen the adaption of connectorised modules to incorporate thermal enhancement. These packaging technologies can now be adapted to suit individual high power chips and sensor devices.