M2.2.3 - High-resolution laser ablation of a copper layer for the fabrication of 3D-printed MEMS and microsensors
- Event
- EUROSENSORS XXXVII
2025-09-07 - 2025-09-10
Wroclaw - Band
- Lectures
- Chapter
- M2.2 - MEMS
- Author(s)
- M. Roig, D. Bourrier, P. -F. Calmon, C. Arvanitis, C. Bergaud, V. Mansard - LAAS-CNRS, Toulouse (France)
- Pages
- 70 - 71
- DOI
- 10.5162/EUROSENSORS2025/M2.2.3
- ISBN
- 978-3-910600-07-2
- Price
- free
Abstract
This paper presents a novel method for structuring metallized layers on a polymer layer using laser ablation. The technique enables the fabrication of metallic tracks with a resolution of about 1 µm with minimal or no damage to the underlying polymer layer. It offers the flexibility required for complex 3D-printed structures and overcomes the limitations of conventional approaches. It will provide an efficient alternative for MEMS fabrication.