D4.5 Non-destructive validation method for understanding water uptake processes of moldings in electronic packaging
- Event
- SMSI 2020
-
(did not take place because of Covid-19 virus pandemic) - Band
- SMSI 2020 - Measurement Science
- Chapter
- D4 Condition Monitoring
- Author(s)
- P. Gierth, L. Rebenklau, U. Gierth, U. Langklotz, M. Schneider - Fraunhofer IKTS, Dresden (Germany)
- Pages
- 291 - 292
- DOI
- 10.5162/SMSI2020/D4.5
- ISBN
- 978-3-9819376-2-6
- Price
- free
Abstract
The long time stability of molding compounds in electronic packages is critical for many applications. Modern characterization methods focusing on pass / fail criteria, so that a deeper understanding of degradation mechanisms could not be achieved in that way. EIS and FTIR , commonly used in corrosion research, were transferred and demonstrated as validation method for the water uptake and chemical changing during loading scenarios. The usability of these non-destructive methods will be demonstrated and the results were used to generate degradation models for such molding materials.