C4.4 - Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements
- Event
- SMSI 2023
2023-05-08 - 2023-05-11
Nürnberg - Band
- Lectures
- Chapter
- C4 - Acoustic MEMS
- Author(s)
- K. Erbacher - Technische Universität Berlin, Berlin (Germany), C. Bourquard, O. Lokesh, L. Wu - Silicon Austria Labs, Villach (Austria), P. Mackowiak, M. Schneider-Ramelow, - Fraunhofer IZM, Berlin (Germany), H. Ngo - University of Applied Sciences Berlin, Berlin (Germany)
- Pages
- 171 - 172
- DOI
- 10.5162/SMSI2023/C4.4
- ISBN
- 978-3-9819376-8-8
- Price
- free
Abstract
This paper presents the packaging and characterization of a piezo-resistive (PR) micro-electro-mechanical system (MEMS) microphone for aero-acoustic measurements with three different mem-brane sizes. The thickness of the square membranes is 5 μm with an edge length of 1900 μm, 2260 μm and 2660 μm, respectively. The results of the sensors characterization show a sensitivity of up to 55 dB re 1 V/Pa when exposed to an acoustic chirp signal ranging from 5-50 kHz at 70-100 dB SPL. This paper presents a test approach necessary for chips with very thin membrane and the results of a dynamic pressure frequency response test.