A7.2 Evaluation of High Temperature Ceramic Sensor Packages
- SMSI 2021
2021-05-03 - 2021-05-06
- SMSI 2021 - Sensors and Instrumentation
- A7 Packaging and Integration of Sensors
- P. Gierth, L. Rebenklau, H. Barth - Fraunhofer Institute IKTS, Dresden (Germany)
- 83 - 84
Modern sensor elements could in many cases withstand very high environmental temperatures. Their only limitations are caused by packaging concepts. Therefore, novel-ceramic packaging concepts seem a promising platform for reaching the next application level. This work discusses technologies, materials and evaluation methods for reaching high temperature stable package solutions. Especially materials for sensor chips mounting inside ceramic packages and package connector mounting up to 600 °C were focused and discussed.