B8.1 Improvements in Thermal Profiling Using High-Definition Fiber Optic Sensing

Event
SMSI 2021
2021-05-03 - 2021-05-06
digital
Band
SMSI 2021 - Sensors and Instrumentation
Chapter
B8 Fiber Optic Sensors
Author(s)
D. Potter, A. Rahim - Luna Innovations, Blacksburg (USA), A. Stern - Luna Innovations, Pfullingen (Germany)
Pages
151 - 152
DOI
10.5162/SMSI2021/B8.1
ISBN
978-3-9819376-4-0
Price
free

Abstract

One of the main challenges of using distributed fiber optic sensing technologies is their sensitivity to both strain and temperature. This paper describes a new development in high-definition distributed fiber optic sensing (based on Rayleigh backscatter and OFDR instrumentation) that provides for the automatic compensation of mechanical strain when measuring distributed temperature, enabling broader adoption of the technology in embedded and surface mounted measurement applications.

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