D5.2 - Optical and Tactile Measurements on SiC Sample Defects

Event
SMSI 2023
2023-05-08 - 2023-05-11
Nürnberg
Band
Lectures
Chapter
D5 - Metrology of compound semiconductors for manufacturing power electronics
Author(s)
J. Grundmann, B. Bodemann - Physikalisch-Technische Bundesanstalt, Braunschweig (Germany), E. Ermilova, A. Hertwig - Bundesanstalt für Materialforschung und -prüfung, Berlin (Germany), P. Klapetek - Cesky Meteorologicky Institut (CMI), Brno (Czechia), S. Pereira, J. Rafighdoost - Delft University of Technology, Delft (Netherlands)
Pages
233 - 234
DOI
10.5162/SMSI2023/D5.2
ISBN
978-3-9819376-8-8
Price
free

Abstract

The different defect types on SiC samples are measured with various measurement methods including optical and tactile methods. The defect types investigated include particles, carrots and triangles and they are analyzed with imaging ellipsometry, coherent Fourier scatterometry and atomic force micros-copy. Each of these methods measures different properties of the defects and they all together con-tribute to a complete analysis.

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