B5.1 - Flip-chip package for pressure sensors with operationtemperatures up to 500 °C
- Event
- AMA Conferences 2015
2015-05-19 - 2015-05-21
Nürnberg, Germany - Band
- Proceedings SENSOR 2015
- Chapter
- B5 - Packaging
- Author(s)
- R. Zeiser, P. Wagner, S. Ayub, J. Wilde - University of Freiburg - IMTEK, Freiburg (Germany), S. Henneck - Robert Bosch GmbH, Stuttgart (Germany)
- Pages
- 273 - 276
- DOI
- 10.5162/sensor2015/B5.1
- ISBN
- 978-3-9813484-8-4
- Price
- free
Abstract
This work presents a novel flip-chip-package for pressure sensors that operate at very high temperatures. The packaging method is based on glass-soldering, gold stud-bumping and low-CTEceramic-substrates. The investigated sensor substrates were aluminiumnitride (AlN), siliconnitride (Si3N4) and a ceramic based on ZrSiO4 that was specific matched to the thermal-mechanical behavior of silicon. The sensor-element consists of thin-film platinum layers on a DRIE-etched silicon membrane. For the protection of the functional layer and the contact-metallization, the sensors are assembled using the developed flip-chip-method. Afterwards, the assemblies were packaged in a steel housing that allows a characterization of the sensors in a high temperature and high pressure atmosphere. Subsequently, the pressure sensitivity and cross-sensitivity on temperature of the sensor output signal was characterized with a special designed test set-up. Results for the sensor offset, the linearity and the signal-change over temperature are given. The effect of long-term storage at 500 °C and thermal shock-cycling with a temperature difference of 470 K on the output-signal and on the reliability of the sensor package was analyzed. Sensors of the most appropriate assemblyconfiguration survived 500 hours of long-term storage and 500 cycles without detection of a failure.