Available documents

Event Title Author(s)
AMA Conferences 2015 B5.1 - Flip-chip package for pressure sensors with operationtemperatures up to 500 °C R. Zeiser, P. Wagner, S. Ayub, J. Wilde - University of Freiburg - IMTEK, Freiburg (Germany), S. Henneck - Robert Bosch GmbH, Stuttgart (Germany)
AMA Conferences 2015 B5.3 - The influence of coating on the sensor wiring in medical guide wires N. Stefanova, T. Opitz, T. Rossner, T. Meiss, R. Werthschützky - Technische Universität Darmstadt (Germany)
AMA Conferences 2015 B5.4 - First Investigation of LTCC package for high temperature SAW sensors J. Bardong, A. Binder - Carinthian Tech Research, Villach/St.Magdalen (Austria), S. Toskov, G. Miskovic, G. Radosavljevic - Institute of Sensor and Actuator Systems, Vienna (Austria)