C1.1 - Sensorial Surfaces – Integrated Sensors for Component- Based Condition Monitoring
- Event
- AMA Conferences 2015
2015-05-19 - 2015-05-21
Nürnberg, Germany - Band
- Proceedings SENSOR 2015
- Chapter
- C1- MEMS Applications
- Author(s)
- C. Winkelmann - Winkelmann Mikrosysteme, Bremen (Germany)
- Pages
- 340 - 345
- DOI
- 10.5162/sensor2015/C1.1
- ISBN
- 978-3-9813484-8-4
- Price
- free
Abstract
The advent of cyber-physical systems and the internet of things will change the way automation and condition monitoring works. Today’s vertically integrated production and monitoring systems will be linked horizontally – not only within single corporations but also across companies in different fields. The paper describes how automation systems and especially condition monitoring systems might look in the future and demonstrates this with the help of five use cases. Additionally, simulation and measurement results of the development of a condition monitoring system for a linear guide are presented. The deformations were carried out in Comsol Multiphysics and show that the measurement of the magnitude as well as the direction of a force acting on the linear guide can be measured. These results were confirmed in practical tests.