2025 SMSI Bannerklein

P2.9 Packaging concepts and development progress of ceramic thermocouples for up to > 1800 °C

Event
SMSI 2020
-
(did not take place because of Covid-19 virus pandemic)
Band
SMSI 2020 - Sensors and Instrumentation
Chapter
P2 Sensors and Measurement Systems for Physical Quantities
Author(s)
P. Gierth, L. Rebenklau, B. Feng, H. Martin - Fraunhofer IKTS, Dresden (Germany)
Pages
242 - 243
DOI
10.5162/SMSI2020/P2.9
ISBN
978-3-9819376-2-6
Price
free

Abstract

Measurement of temperatures is critical for many technical applications in the modern industries. Common used temperature sensors are based on metallic and not many alternatives are given until today. Therefore, semiconductive ceramic materials based on boron carbide were developed to generate miniaturized thermocouples for temperatures up to > 1800 °C. An overview of the ongoing development process of the system embedding of this kind of thermocouples is given. Risks and chances of ceramic thermocouples were discussed.

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