P2.9 Packaging concepts and development progress of ceramic thermocouples for up to > 1800 °C
- Event
- SMSI 2020
-
(did not take place because of Covid-19 virus pandemic) - Band
- SMSI 2020 - Sensors and Instrumentation
- Chapter
- P2 Sensors and Measurement Systems for Physical Quantities
- Author(s)
- P. Gierth, L. Rebenklau, B. Feng, H. Martin - Fraunhofer IKTS, Dresden (Germany)
- Pages
- 242 - 243
- DOI
- 10.5162/SMSI2020/P2.9
- ISBN
- 978-3-9819376-2-6
- Price
- free
Abstract
Measurement of temperatures is critical for many technical applications in the modern industries. Common used temperature sensors are based on metallic and not many alternatives are given until today. Therefore, semiconductive ceramic materials based on boron carbide were developed to generate miniaturized thermocouples for temperatures up to > 1800 °C. An overview of the ongoing development process of the system embedding of this kind of thermocouples is given. Risks and chances of ceramic thermocouples were discussed.