P2.10 Validation of High-Temperature Stable Sensor Packaging Materials and Methods
- SMSI 2020
(did not take place because of Covid-19 virus pandemic)
- SMSI 2020 - Sensors and Instrumentation
- P2 Sensors and Measurement Systems for Physical Quantities
- P. Gierth, L. Rebenklau, H. Barth - Fraunhofer IKTS, Dresden (Germany)
- 244 - 245
Many modern sensor concepts are only limited in their operating temperature because of insufficient packaging solutions. Therefore, novel-packaging concepts needs to be evaluated on all interconnec-tion levels. This work summarizes possible materials, technologies and characterization methods for reaching high temperature stable packages. Especially materials for sensor chips mounting inside ceramic packages and package connector mounting up to 600 °C were focused and discussed.