P2.10 Validation of High-Temperature Stable Sensor Packaging Materials and Methods

Event
SMSI 2020
-
(did not take place because of Covid-19 virus pandemic)
Band
SMSI 2020 - Sensors and Instrumentation
Chapter
P2 Sensors and Measurement Systems for Physical Quantities
Author(s)
P. Gierth, L. Rebenklau, H. Barth - Fraunhofer IKTS, Dresden (Germany)
Pages
244 - 245
DOI
10.5162/SMSI2020/P2.10
ISBN
978-3-9819376-2-6
Price
free

Abstract

Many modern sensor concepts are only limited in their operating temperature because of insufficient packaging solutions. Therefore, novel-packaging concepts needs to be evaluated on all interconnec-tion levels. This work summarizes possible materials, technologies and characterization methods for reaching high temperature stable packages. Especially materials for sensor chips mounting inside ceramic packages and package connector mounting up to 600 °C were focused and discussed.

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