6.1.4 - Controlling Interconnection Density in 3D ZnO Networks for Optimized Charge Transport and Multimodal Sensing
- Event
- EUROSENSORS 2026
2026-09-06 - 2026-09-09
Zurich - Band
- Lectures
- Chapter
- Chemical Sensors
- Author(s)
- B. Chakraborty, L. Siebert, R. Adelung - Kiel University,Kiel (Germany), B. Junker -Reiss - Eberhard Karls Universität Tübingen,Tübingen (Germany)
- Pages
- 192 - 193
- DOI
- 10.5162/eurosensors2026/6.1.4
- ISBN
- 978-3-910600-12-6
- Price
- free
Abstract
Three ‑ dimensional (3D) tetrapodal ZnO (t ‑ ZnO) networks are promising for multifunctional sensing but often suffer from poor interparticle connectivity, which limits charge transport and sensitivity. We introduce interconnection density as a tuneable design axis governing both electronic and sensing behaviour in 3D semiconductor frameworks. Through a UV ‑ driven photoelectrochemical approach, nanoscale ZnO bridges are selectively formed between tetrapodal arms, enabling controlled tuning of network connectivity. The optimized interconnected networks show a 25 ‑ fold enhancement in UV response and highly efficient gas detection (10x enhancement), while preserving low ‑ cost and scalable fabrication. Interconnection engineering thus emerges as a general route toward next ‑ generation multimodal sensors [5].