B2.3 - From Basic Flow Property to MEMS Multiparameter Sensors

Event
AMA Conferences 2015
2015-05-19 - 2015-05-21
Nürnberg, Germany
Band
Proceedings SENSOR 2015
Chapter
B2 - MEMS & NEMS
Author(s)
R. Beigelbeck, S. Cerimovic, A. Talic, F. Kohl, A. Jachimowicz, T. Sauter - Danube University Krems, Wiener Neustadt (Austria), T. Voglhuber-Brunnmaier, B. Jakoby - Johannes Kepler University, Linz (Austria), G. Urban - IMTEK, University of Freiburg (Germany)
Pages
216 - 221
DOI
10.5162/sensor2015/B2.3
ISBN
978-3-9813484-8-4
Price
free

Abstract

Thermal sensors rely on a simple transduction principle. They exhibit the advantage of having a simple and easy-to-manufacture structure requiring no moving parts, which makes them robust, costeffective, and versatile. Consequently, they are widely used in many applications. This paper demonstrates how basic calorimetric flow and thermal parameter sensors, both based on silicon thinfilm technology, can be extended to more sophisticated devices by modifying the sensor layout or by altering the measurement method. In the context of flow sensors, we introduce direction and angular resolved devices as well as an ultra-low power and a multiport hot-film device. In terms of thermal parameter sensors, we report on two different designs to measure the thermal conductivity and diffusivity of fluids at rest. Finally, we also present two concepts of how to merge calorimetric flow sensors and thermal parameter sensors into multiparameter flow sensors which offer a self-calibrating feature irrespective of the fluid type and flow state.

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