A7.1 - FLEXIBLE FREE STANDING SU-8 MICROFLUIDIC IMPEDANCE SPECTROSCOPY SENSOR FOR 3D MOLDED INTERCONNECT DEVICES APPLICATION
- AMA Conferences 2015
2015-05-19 - 2015-05-21
- Proceedings SENSOR 2015
- A7 - Impedance Spectroscopy
- M. Schmidt, A. Oseev, A. Brose - Otto von Guericke University Magdeburg, Magdeburg (Germany), C. Engel - TEPROSA GmbH, Magdeburg (Germany), S. Hirsch - University of Applied Sciences Brandenburg (Germany)
- 151 - 155
Current contribution reports a new microfluidic impedance spectroscopy sensor that is applicable for direct attachment on 3D molded interconnect devices (3D-MID). The Sensor is made of flexible SU-8 polymer featured by the system of electrodes structured directly on SU-8. Sensor chip is able to be directly soldered on MID due to electroless plated Nickel contact pads. Due to opposite electrodes design and one side direct shielded attachment, sensor is able to be applied for measurements in intensive electromagnetic environment. To the best of our knowledge none of such sensors has been previously reported.