B3.3 - Advanced Glass Packaging with Integrated Stress Relief Structures for MEMS Pressure Sensors
- Event
- SMSI 2025
2025-05-06 - 2025-05-08
Nürnberg - Band
- Lectures
- Chapter
- B3 - Pressure Sensors and their Applications
- Author(s)
- M. Bertke, S. Schudak - LPKF Laser & Electronics SE, Garbsen (Germany)
- Pages
- 93 - 94
- DOI
- 10.5162/SMSI2025/B3.3
- ISBN
- 978-3-910600-06-5
- Price
- free
Abstract
Advanced glass packaging with integrated stress relief structures for MEMS pressure sensors, enabled by Laser Induced Deep Etching (LIDE) technology, effectively isolates sensing elements from packageinduced stresses. Our simulations demonstrate that hermetically sealed corrugated membrane structures reduce thermal induced stress by up to 99,4 % when subjected to CTE mismatch between glass and FR4 substrates. The integrity and mechanical stability of the glass is maintained, as processing with the LIDE technology does not create any imperfections such as microcracks or internal stresses.